Shengcheng Wang received his Bachelor degree in Microelectronics at Nankai University, China (2007) and Ph.D. (Dr.-Ing.) in Computer Science from the Karlsruhe Institute of Technology (KIT) Germany in 2018. His dissertation addresses the reliability challenge of 3D integration with main focus on reliability issues of Through Silcon Vias (TSVs).
"Reliable Design of Three-Dimensional Integrated Circuits" 2012-2018